

ANSI/TIA/EIA 607
Commercial Building Grounding and Bonding Requirements for Telecommunications
OVERVIEW OF THE
TELECOMMUNICATIONS GROUNDING AND BONDING INFRASTRUCTURE
The electrical service
entrance is outside the scope of this Standard and is grounded and bonded
in accordance with all applicable electrical codes.
In all cases the applicable electrical codes for bonding and grounding for
telecommunications shall be met.
The telecommunications
grounding and bonding infrastructure begins with a
connection to the service equipment (power) ground and extends throughout
the building.
Although the electrical
closet and associated panelboard(s) are not part of the
telecommunications infrastructure, they are referenced because they are integral
to grounding and bonding.
COMPONENTS OF
THE TELECOMMUNICATIONS GROUNDING AND BONDING
INFRASTRUCTURE
Major components of the
grounding and bonding infrastructure are:
- the identification elements
- the bonding conductor for telecommunications
- the Telecommunications Bonding Backbone (TBB)
- the Telecommunications Main Grounding Busbar (TMGB)
- the Telecommunications Grounding Busbar (TGB)
- the Telecommunications Bonding Backbone Interconnecting Bonding Conductor (TBBIBC)
All bonding conductors
shall:
- be listed for the purpose intended and approved by a Nationally Recognized
Testing Laboratory (NRTL).
- be insulated and copper. The minimum bonding conductor size shall be
a No. 6 AWG.
- be bonded to each end of the conduit with a No. 6 AWG ground wire at
a minimum if the conductors are inserted in a metallic conduit longer
than 1 m (3ft)
- be marked appropriately by a distinctive green color.
Labels, Color-Coding,
and Markings
Labels shall:
- be attached to each telecommunications bonding conductor
- be located on conductors as close as practicable (ie., ease of access
to read the label) to their point of termination
- be nonmetallic. Refer to ANSI/TIA/EIA 606 for additional labeling requirements.
Bonding Conductors
for Telecommunications
The bonding conductor
for telecommunications shall:
- bond the TMGB to the service equipment (power) ground
- be, at a minimum, the same size as the TBB (see below)
The Telecommunications
Bonding Backbone (TBB)
The TBB is a conductor:
- that interconnects all TGBs with the TMGB
- reduces or equalizes potential differences between telecommunications
systems bonded to it.
A TBB is not intended
to serve as the only conductor providing a ground fault current return path.
A TBB(s) originates at
the TMGB, and connects to the TGB(s) in all telecommunications closets and
equipment rooms.
A TBB design should take
into account:
- type of building construction, building size
- the telecommunications requirements
- the configuration of the telecommunications pathways and spaces.
the TBB shall:
- be designed with over all design of the telecommunications backbone
cabling system in mind
- permit multiple TBBs as required
- minimize the lengths of the TBBs
- be an insulated copper conductor
- have minimum conductor size of No. 6 AWG, and as large as No 3 AWG
- be bonded together with a TBB interconnecting bonding conductor (TBBIBC)
at the top floor and at a minimum of every third floor in between when
two or more vertical TBBs are used in a multistory building
- be connected to the TMGB
Water pipes shall not
be used as a TBB.
Metallic cable shield
shall not be used as a TBB in new installations.
Installation Considerations
TBB conductors:
- shall be protected from physical and mechanical damage
- should be installed without splices, where practicable.
If splices are required,
they:
- should be minimum and shall be accessible and located in telecommunications
spaces
- shall be connected using irreversible compression-type connectors, exothermic welding,
or equivalent
- shall have joints adequately supported and protected from damage
The Telecommunications
Main Grounding Busbar (TMGB)
The TMBG serves as:
- the dedicated extension of the building grounding electrode system for
the telecommunications infrasfructure
- the central attachment point for telecommunications bonding backbones
(TBB) and equipment, and is located such that it is accessible to
telecommunications personnel
The TMGB should:
- be located in the telecommunications entrance room
- minimize the bonding conductor length for telecommunications
- serve telecommunications equipment that is located within the same room
or space.
Extensions of the TMGB
(i.e., other busbars) shall be telecommunications grounding busbars (TGB).
Typically, there should be a single TMGB per building.
The TMGB shall:
- be a predrilled copper busbar provided with standard NEMA bolt hole
sizing and spacing for the type of connectors to be used
- be sized with the immediate requirements and future growth in mind
- have minimum dimensions of 6 mm thick x 100 mm wide and a length as
required.
The TMGB should:
- be electrotin plated for reduced contact resistance or if not plated,
the busbar shall be cleaned prior to fastening of conductors.
Bonding to a Panelboard
for Telecommunications
The TMGB shall:
- be as close to the panelboard for telecommunications as is practicable
- maintain clearances required by applicable electrical codes
- have a panelboards Alternating Current Equipment Ground bus, or enclosure
bonded to the TMGB
- use listed 2-hole compression connectors, exothermic type welded connections,
or equivalent for the bonding conductor connections
- be bonded to all metallic raceways used for telecommunications cable
within the same room or space
- be insulated from its support (50mm is recommended)
The TMGB should:
- be located to the side of the panelboard
- be located vertically based on the entrance point of the cables (eg:
overhead or from below)
- use 2 hole compression connectors
The Telecommunications
Grounding Busbar (TGB)
The (TGB) is the common
connection point for telecommunications systems and equipment in the location
served by that telecommunications closet or equipment room.
The TGB shall:
- be a predrilled copper busbar provided with standard NEMA bolt hole
sizing and spacing for the type of connectors to be used
- have minimum dimensions of 6 mm thick x 50 mm wide and variable in length
immediate requirement with consideration of future growth
- be cleaned prior to fastening the conductors to the busbar
- have TBBs and other TGBs within the same space bonded to the TGB
- have the a continuous bonding conductor between the TBB and TGB routed
in the shortest straight line path
- have a panelboards Alternating Current Equipment Ground bus, or enclosure
bonded to the TGB
- maintain clearances required by applicable electrical codes
- have the TGB shall be bonded to the TBBIBC as per 5.3.4.2 of the original
standards documentation
- be bonded to all metallic raceways used for telecommunications cable
within the same room or space
- use listed 2-hole compression connectors to connect the TBB to the TGB
- be insulated from its support (50mm is recommended)
The TGB should:
- be electrotin-plated for reduced contact resistance
- bond the panelboard's ACEG or enclosure to the TGB if the TGB is not
in the same space as the panelboard
- be located to the side of the panelboard
- be located vertically based on the entrance point of the cables (eg:
overhead or from below)
Bonding to the
Metal Frame
The metal frame of a building
shall be bonded with a No. 6 AWG conductor to:
- all TGBs where the metal frames are effectively grounded
- the TGB where the metal frame is external to the room
- the TMGB where the metal frame is external to the room
TGBs may be grounded to
horizontal steel members in lieu of vertical members if, the horizontal members
are permanently electrically bonded to the vertical members. B onding conductors
and connectors for bonding the metal frame of a building shall be listed
and approved for the purpose intended.
This Standard does not
require the steel bars of a reinforced concrete building to be bonded to the
TGB or TEF.
TELECOMMUNICATIONS
ENTRANCE FACILITY
The TMBG:
- should be located in the TEF
- is the common point to which all grounding connections in a TEF are
made
- may serve as the TGB for collocated equipment in the TEF
- should be located to facilitate the straightest route from the primary
rotectors to the TMGB
- shall be as close to the panelboard for telecommunications as practicable
- shall be installed to maintain clearances required by applicable electrical
codes
Location of the
TMGB
- primary protectors shall be separated by a minimum of 300mm (1ft) from
any DC power, switchboard or high frequency cables even when these cable
are contained in metallic or EMT conduit
- the TMGB should be located near the backbone cabling and associated
terminations
- the TMGB should be located so that the bonding conductor for telecommunications
is as short and straight as possible.
Other Attachments
to the TMGB/TGB
The following elements
shall be bonded to the TMGB/TGB
- the shield or metallic member of a backbone cable
- telecommunications primary protectors on the inter-building backbone
cables
- the pathway on the building side of an isolation gap in the telecommunications
entrance facility
TELECOMMUNICATIONS
ROOM and EQUIPMENT ROOM
The TGB shall:
- be located in each telecommunications room and equipment room
- be insulated from its support and separated by a minimum of 50mm
- be located to provide the greatest flexibility and accessibility for
telecommunications system grounding by minimizing lengths and number of
bends of the bonding conductor to the TGB
- be bonded together with all other TGBs in the same space
The TGB should:
- be located near the backbone cabling and associated terminations if
no panelboard has been installed in the telecommunications room
- be located so that the grounding conductors are as short and straight
as possible